1, the bottom plate ceramic substrate Al2O3 content ≥ 90%;;
2. Outer lead material: fixed-expansion alloy (4J42).;
3、Gas tightness: helium leakage rate ≤5*10-9/Pa.m3//s;.;
4、Insulation resistance：＞1*1010/Ω；.;
5, appearance in line with the "integrated circuit black ceramic low-temperature glass fusion shell factory inspection specifications".
6, good heat dissipation performance, good shading, radiation resistance, moisture-proof, internal high temperature, internal thermal shock and high strength of the electronic packaging shell.
Black ceramic low-temperature glass encapsulation, is a low melting point glass and black alumina ceramic as the material for IC chip encapsulation protection technology, black ceramic is the ideal material for a variety of chip encapsulation, small size, with good mechanical, electrical and chemical properties, and encapsulation process is simple, low price, high reliability. Suitable for mass production can be widely used in military and civilian high-reliability products, has a broad market prospects and development space.
