SMD Silver Copper Cover (Composite Cover) - Corex Technology Corporation - Focus on Packaging Enclosure | Packaging Accessories | IC Packaging | Multilayer Ceramic Enclosure | Black Ceramic Enclosure | Microcrystalline Glass Enclosure | T0 Cap | Transition Tab | Lavalable Frame | Metal Cover | Leadframe

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SMD Silver Copper Cover (Composite Top)

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SMD Silver-Copper Lids SMD Ag-Cu Lids

Composition: Ag72Cu28/Ag80Cu20

Melting point: 780 degrees

Characteristics: Can be used directly in PKG without sealing ring / Can be used directly in usual sealing welder

Product Use

SMD Silver-Copper Cover SMD Ag-Cu Lids Composition: Ag72Cu28/Ag80Cu20 Melting Point: 780 Degrees Characteristics: Can be used directly in PKG without sealing ring / Can be used directly in the usual sealing soldering machine.

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SMD Silver Copper Cover (Composite Top)

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SMD Silver Copper Cover (Composite Top)

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