The company is a National High-Tech Enterprise, a National “Specialized, Specialized, and New Little Giant” Enterprise, a Provincial Innovative Enterprise, a Provincial Small, Medium, and Micro-Technology Leading Enterprise, a Provincial Ceramic Packaging Materials Enterprise Engineering and Technology Research Center, a Fujian Province Intellectual Property Advantage Enterprise, and a Municipal Enterprise Technology Center. The company currently specializes in the production and R&D of electronic ceramics, microelectronic packaging products, and LED lighting products. Many of its products have won national, provincial, and municipal scientific research achievement awards; in 2008, its surface-mount integrated circuit low-temperature glass packaging was recognized as a National Key New Product and a Provincial Excellent New Product.

We have 3 national invention patents, 34 utility model patents and 2 design patents. The electronic package covers produced by the company are widely used in crystal oscillators, resonators, surface acoustic wave filters (SAW) and integrated circuits, and the products are sold throughout the country and exported to the world. IC black ceramic low temperature glass package shell (CERDIP, CFP two kinds) is an important manufacturer in China, mainly used in military, automotive, medical equipment and microelectronics packaging for high quality and reliability requirements. The products are sold to Beijing, Shanghai, Shenzhen, Chongqing, Xi'an, Jiangsu, Gansu, Liaoning, Hunan, Guizhou and other provinces, municipalities and autonomous regions. 2015 the company invested 10 million yuan on the new CFP encapsulation shell and lead frame project, the products are supplied to the United States and other countries....